(China (Mainland))
Product Summary
The IRKT91-12 is a generation V of Add-A-pak module. The IRKT91-12 combines the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.
Parametrics
IRKT91-12 absolute maximum ratings: (1)IT(AV) or IF(AV)@ 85℃: 95A; (2)IO(RMS): 210 A; (3)ITSM @ 50Hz: 1785 A; (4)IFSM @ 60Hz: 1870 A; (5)I2t @ 50Hz: 15.91 KA2s; @ 60Hz: 14.52 KA2s; (6)I2√t: 159.1 KA2√s; (7)VRRM range: 400 to 1600 V; (8)TSTG: -40 to 125℃; (9)TJ: -40 to 125℃.
Features
IRKT91-12 features: (1)High Voltage; (2)Industrial Standard Package; (3)Thick Al metal die and double stick bonding; (4)Thick copper baseplate; (5)UL E78996 approved; (6)3500VRMS isolating voltage.
Diagrams
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